CEM561

COM Express Type 6 Compact Module with 13th/12th Gen Intel® Core™ or Celeron® Processor

Features

  • 13th/12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (Raptor Lake U/Alder Lake U)
  • Dual channel DDR4-3200 SO-DIMM for up to 64GB memory
  • Up to 12 lanes of PCI Express
  • 2 SATA 3.0
  • 4 USB 3.2 and 8 USB 2.0
  • Supports NVMe for up to 512GB
  • Supports TPM 2.0
  • Intel® Gen9 Graphics Engine
  • Lithium battery support
  • Hardware monitoring
  • Wake-on-LAN and PXE Boot ROM support
  • Smart battery support
Computer
Processor13th/12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (U series)
ChipsetSoC integrated
System Memory2x Dual-channel DDR4-3200 SO-DIMM slot, up to 64GB
BIOSAMI uEFI (Legacy free)
Watchdog Timer65536 levels, 0 to 65535 sec.
TPMTPM 2.0
Storage
SSDNVMe for up to 512GB memory (optional)
SATA2x SATA 3.0
Expansion
PCIe1x PCIe x4 Gen4 (PEG) + 5x PCIe Gen3 (default) or 1x PCIe x4 Gen4 (PEG) + 8x PCIe Gen3 (by request)
Display
GraphicsIntel® Gen9 Graphics Engine
Graphics SupportGfx-DX12.0, OCL2.0, and OGL4.3
Display Interface1x LVDS 18/24-bit single/dual channel (optional eDP1.4b HBR3 5120x3200@60Hz) or 1x VGA 1920x1200@60Hz (default)
Display Capability2x Display type (with up to 4K supported)
I/o interfaces
Ethernet1x 10/100/1000/2500 Mbps Ethernet with Intel® I226, supporting Wake-on-LAN and PXE Boot ROM
USB4x USB 3.2 and 8x USB 2.0
Serial1x LPC, 1x SPI, 2x TX/RX
AudioHD link interface to baseboard for audio codec
I2C1x I2C
GPIO4-CH in/4-CH out
SMBusYes
Power
Power InputATX: +12V, +5VSB; AT: +12V
BatteryLithium battery
Smart BatteryYes
Physical
Dimensions95x95mm
Board Thickness2.0mm
Form FactorCOM Express Type 6 Compact Module
Environmental
Operating TemperatureStandard SKU: 0°C to +60°C (-40°F to +140°F); Extended Temperature SKU: -40°C to +85°C (-40°F to +185°F) with system thermal solution
Relative Humidity10% to 95% non-condensing
Vibration Endurance3.5 Grms
Computer
Processor13th/12th Gen Intel® Core™ i7/i5/i3 or Celeron® processor (U series)
ChipsetSoC integrated
System Memory2x Dual-channel DDR4-3200 SO-DIMM slot, up to 64GB
BIOSAMI uEFI (Legacy free)
Watchdog Timer65536 levels, 0 to 65535 sec.
TPMTPM 2.0
Storage
SSDNVMe for up to 512GB memory (optional)
SATA2x SATA 3.0
Expansion
PCIe1x PCIe x4 Gen4 (PEG) + 5x PCIe Gen3 (default) or 1x PCIe x4 Gen4 (PEG) + 8x PCIe Gen3 (by request)
Display
GraphicsIntel® Gen9 Graphics Engine
Graphics SupportGfx-DX12.0, OCL2.0, and OGL4.3
Display Interface1x LVDS 18/24-bit single/dual channel (optional eDP1.4b HBR3 5120x3200@60Hz) or 1x VGA 1920x1200@60Hz (default)
Display Capability2x Display type (with up to 4K supported)
I/o interfaces
Ethernet1x 10/100/1000/2500 Mbps Ethernet with Intel® I226, supporting Wake-on-LAN and PXE Boot ROM
USB4x USB 3.2 and 8x USB 2.0
Serial1x LPC, 1x SPI, 2x TX/RX
AudioHD link interface to baseboard for audio codec
I2C1x I2C
GPIO4-CH in/4-CH out
SMBusYes
Power
Power InputATX: +12V, +5VSB; AT: +12V
BatteryLithium battery
Smart BatteryYes
Physical
Dimensions95x95mm
Board Thickness2.0mm
Form FactorCOM Express Type 6 Compact Module
Environmental
Operating TemperatureStandard SKU: 0°C to +60°C (-40°F to +140°F); Extended Temperature SKU: -40°C to +85°C (-40°F to +185°F) with system thermal solution
Relative Humidity10% to 95% non-condensing
Vibration Endurance3.5 Grms
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