CEM530
COM Express Type 6 Basic Module with Intel® Xeon® or 9th/8th Gen Intel® Core™ Processor and Intel® CM246/QM370
Features
- Intel® Xeon® or 9th/8th gen Intel® Core™ processor
- Intel® CM246/QM370 chipset
- Dual channel DDR4-2666 SO-DIMM for up to 64GB of memory
- 1 PCIe x16 and 8 PCIe x1 Gen3
- 4 SATA Gen3 with RAID 0/1/5/10
- 4 USB 3.2 and 8 USB 2.0
- Supports TPM 2.0
Computer
CPUIntel® Xeon® or 9th/8th gen Intel® Core™ processor (Coffee Lake & Coffee Lake Refresh)
System MemoryDual channel DDR4-2666 SO-DIMM, up to 64GB (or 96GB by request)
ChipsetIntel® CM246/Intel® QM370
BIOSAMI uEFI (Legacy Free)
Watchdog Timer65536 levels, 0 to 65535 sec.
Display
ChipsetIntel® Gen9 HD Graphic, Gfx APIs - DX11/12, OCL 2.x, OGL 4.3/4.4, 3 independent displays
Display Interface1x LVDS 18/24-bit single/dual channel (default), optional with eDP 1.4: 4096x2304@60Hz; 1x VGA: 1920x1200@60Hz (default); 2x DDI (DisplayPort 1.2: 4096x2304@60Hz / HDMI 1.4: 4096x2160@30/24Hz)
Expansion
PCIe1x PCIe x16 Gen3, 8x PCIe x1 Gen3
I/o interfaces
SATA4x SATA Gen3 with RAID 0/1/5/10
Ethernet1x 10/100/1000 Mbps Ethernet with Intel® I219-LM; supports Wake-on-LAN, PXE Boot ROM
AudioHD link interface to baseboard for Codec
USB4x USB 3.2 Gen2, 8x USB 2.0
Serial1x LPC, 1x SPI, 2x TX/RX
TPMTPM 2.0
SMBusYes
I2C1x I2C
GPIO4-CH in & 4-CH out (SDIO optional)
Smart BatteryYes
Hardware MonitoringYes
Power
Power InputATX: +12V, +5VSB; AT: +12V
Physical
Dimensions125 x 95 mm
Board Thickness2.0 mm
Form FactorCOM Express Type 6 Basic Module
Environmental
Operating Temperature-40°C to +85°C (-40°F to +185°F) with system thermal solution (operation with heatsink and fan)
Humidity10%-95% relative humidity, non-condensing
Vibration3.5 Grms
Computer
CPUIntel® Xeon® or 9th/8th gen Intel® Core™ processor (Coffee Lake & Coffee Lake Refresh)
System MemoryDual channel DDR4-2666 SO-DIMM, up to 64GB (or 96GB by request)
ChipsetIntel® CM246/Intel® QM370
BIOSAMI uEFI (Legacy Free)
Watchdog Timer65536 levels, 0 to 65535 sec.
Display
ChipsetIntel® Gen9 HD Graphic, Gfx APIs - DX11/12, OCL 2.x, OGL 4.3/4.4, 3 independent displays
Display Interface1x LVDS 18/24-bit single/dual channel (default), optional with eDP 1.4: 4096x2304@60Hz; 1x VGA: 1920x1200@60Hz (default); 2x DDI (DisplayPort 1.2: 4096x2304@60Hz / HDMI 1.4: 4096x2160@30/24Hz)
Expansion
PCIe1x PCIe x16 Gen3, 8x PCIe x1 Gen3
I/o interfaces
SATA4x SATA Gen3 with RAID 0/1/5/10
Ethernet1x 10/100/1000 Mbps Ethernet with Intel® I219-LM; supports Wake-on-LAN, PXE Boot ROM
AudioHD link interface to baseboard for Codec
USB4x USB 3.2 Gen2, 8x USB 2.0
Serial1x LPC, 1x SPI, 2x TX/RX
TPMTPM 2.0
SMBusYes
I2C1x I2C
GPIO4-CH in & 4-CH out (SDIO optional)
Smart BatteryYes
Hardware MonitoringYes
Power
Power InputATX: +12V, +5VSB; AT: +12V
Physical
Dimensions125 x 95 mm
Board Thickness2.0 mm
Form FactorCOM Express Type 6 Basic Module
Environmental
Operating Temperature-40°C to +85°C (-40°F to +185°F) with system thermal solution (operation with heatsink and fan)
Humidity10%-95% relative humidity, non-condensing
Vibration3.5 Grms
