CEM510

COM Express Type 6 Module with Intel® Xeon® E3/7th Gen Intel® Core™ i7/i5/i3 Processors and Intel® CM238/QM175/HM175

Features

  • Intel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 processors (Kaby Lake-H)
  • Intel® CM238/QM175/HM175 chipset
  • 2 DDR4-2133 SO-DIMM slots, up to 32GB ECC or non-ECC
  • 1 PCIe x16 and 8 PCIe x1 (Gen3)
  • 4 SATA-600 with RAID 0/1/5/10
  • 4 USB 3.0 and 8 USB 2.0
  • Intel® AMT 11.0 and TPM 2.0 function supported
  • Intel® Gen 9 HD Graphic with DX11/12, OCL2.x, OGL 4.3/4.4
  • 3 independent displays
  • 1 x LVDS interface (18/24-bit single/dual channel, optional eDP)
  • 1 x VGA, up to 1920 x 1200 @60Hz
  • 2 x DDI (DisplayPort/HDMI/DVI)
  • 1 Gigabit Ethernet with Wake-on-LAN and PXE Boot ROM
  • TPM 2.0
  • Hardware Monitoring
  • Smart Battery support
  • 4-CH Digital I/O (4-CH in & 4-CH out)
Computer
ProcessorIntel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 (Kaby Lake-H)
ChipsetIntel® CM238/QM175/HM175
System Memory2 x DDR4-2133 SO-DIMM, up to 32GB
BIOSAMI uEFI (Legacy Free)
Watchdog Timer65536 levels, 0 ~ 65535 sec.
Display
GraphicsIntel® Gen 9 HD Graphic
Graphics APIsDX11/12, OCL2.x, OGL 4.3/4.4
Display Outputs3 independent displays
LVDS18/24-bit single/dual channel, optional 18/24-bit single/dual channel with eDP
VGAup to 1920 x 1200 @60Hz
DDI2 x DisplayPort/HDMI/DVI
I/o interfaces
LPC1 x interface
SPI1 x interface
I2C1 x interface
Serial2 x TX/RX interface
USB4 x USB 3.0, 8 x USB 2.0
Ethernet1 port 10/100/1000 Mbps with Wake-on-LAN, PXE Boot ROM (Intel® i219LM)
AudioHD link interface to baseboard for Codec
Digital I/O4-CH in & 4-CH out
TPMTPM 2.0
SMBusYes
Smart BatteryYes
Storage
SATA4 x SATA-600 with RAID 0/1/5/10
Expansion
PCIe x16 Gen 3.01 x
PCIe x1 Gen 3.08 x
Power
Power InputATX: +12V, +5VSB; AT: +12V
Physical
Form FactorCOM Express Type 6 Basic Module
Size125 x 95 mm
Board Thickness2.0 mm
Environmental
Operating Temperature-40°C to +85°C (-40°F to +185°F)
Operating Humidity10% to 95% relative humidity, non-condensing
Vibration3.5 Grms
Computer
ProcessorIntel® Xeon® E3 and 7th gen Intel® Core™ i7/i5/i3 (Kaby Lake-H)
ChipsetIntel® CM238/QM175/HM175
System Memory2 x DDR4-2133 SO-DIMM, up to 32GB
BIOSAMI uEFI (Legacy Free)
Watchdog Timer65536 levels, 0 ~ 65535 sec.
Display
GraphicsIntel® Gen 9 HD Graphic
Graphics APIsDX11/12, OCL2.x, OGL 4.3/4.4
Display Outputs3 independent displays
LVDS18/24-bit single/dual channel, optional 18/24-bit single/dual channel with eDP
VGAup to 1920 x 1200 @60Hz
DDI2 x DisplayPort/HDMI/DVI
I/o interfaces
LPC1 x interface
SPI1 x interface
I2C1 x interface
Serial2 x TX/RX interface
USB4 x USB 3.0, 8 x USB 2.0
Ethernet1 port 10/100/1000 Mbps with Wake-on-LAN, PXE Boot ROM (Intel® i219LM)
AudioHD link interface to baseboard for Codec
Digital I/O4-CH in & 4-CH out
TPMTPM 2.0
SMBusYes
Smart BatteryYes
Storage
SATA4 x SATA-600 with RAID 0/1/5/10
Expansion
PCIe x16 Gen 3.01 x
PCIe x1 Gen 3.08 x
Power
Power InputATX: +12V, +5VSB; AT: +12V
Physical
Form FactorCOM Express Type 6 Basic Module
Size125 x 95 mm
Board Thickness2.0 mm
Environmental
Operating Temperature-40°C to +85°C (-40°F to +185°F)
Operating Humidity10% to 95% relative humidity, non-condensing
Vibration3.5 Grms
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