CEM501
COM Express® Basic Type 6 Module with LGA1151 Socket 9th/8th Gen Intel® Core™ i7/i5/i3 or Celeron® Processor and Intel® H310
Features
- 6th gen Intel® Core™ i7/i5/i3 and Celeron® processors (Skylake-U)
- 2 DDR4-2133 SO-DIMM, up to 32GB
- Max. up to 6 lanes of PCI Express
- 3 SATA-600
- 4 USB 3.0 and 8 USB 2.0
- AXView 2.0 intelligent remote management software
- TPM 1.2 supported
- Hardware Monitoring
- Wake-on-LAN and PXE Boot ROM support
- 1 Gigabit Ethernet
- 4 channels Digital I/O IN & 4 channels OUT
- SMBus support
- Battery Support
Computer
CPU6th gen Intel® Core™ i7-6600U (2.6 GHz), i5-6300U (2.4 GHz), i3-6100U (2.3 GHz), Celeron® 3955U (2.0 GHz) - Skylake-U
System Memory2x260-pin DDR4-2133 SO-DIMM, up to 32GB
ChipsetSoC integrated
BIOSAMI uEFI (Legacy free)
Watchdog Timer65536 levels, 0~65535 sec.
Display
Graphics EngineIntel® Gen 9 Graphics Engine with DX12.0, OCL2.0, OGL4.3 support
Display Interface2x DDI (DP/HDMI/DVI), 1x LVDS 18/24-bit dual channel
I/o interfaces
Ethernet1 port 10/100/1000 Mbps with Wake-on-LAN and PXE Boot ROM (Intel® i219LM)
USB4x USB 3.0 and 8x USB 2.0
Serial2x Serial TX/RX
LPC1x LPC interface
SPI1x SPI interface
I2C1x I2C interface
AudioHD link interface to baseboard for Codec
Digital I/O4 channels IN & 4 channels OUT (SDIO optional)
SMBusYes
TPMTPM 1.2
Hardware MonitoringYes
Storage
SATA3x SATA-600
Expansion
PCI Express6 lanes of PCI Express Gen 3.0
Power
Power InputATX +12V, +5V; SB AT +12V
Battery SupportYes
Physical
Form FactorCOM Express Type 6 Compact Module
Size95x95mm
Board Thickness2.0mm
Environmental
Operating Temperature-40°C to +85°C
Operating Humidity10% to 95% relative humidity, non-condensing
Vibration3.5 Grms
Computer
CPU6th gen Intel® Core™ i7-6600U (2.6 GHz), i5-6300U (2.4 GHz), i3-6100U (2.3 GHz), Celeron® 3955U (2.0 GHz) - Skylake-U
System Memory2x260-pin DDR4-2133 SO-DIMM, up to 32GB
ChipsetSoC integrated
BIOSAMI uEFI (Legacy free)
Watchdog Timer65536 levels, 0~65535 sec.
Display
Graphics EngineIntel® Gen 9 Graphics Engine with DX12.0, OCL2.0, OGL4.3 support
Display Interface2x DDI (DP/HDMI/DVI), 1x LVDS 18/24-bit dual channel
I/o interfaces
Ethernet1 port 10/100/1000 Mbps with Wake-on-LAN and PXE Boot ROM (Intel® i219LM)
USB4x USB 3.0 and 8x USB 2.0
Serial2x Serial TX/RX
LPC1x LPC interface
SPI1x SPI interface
I2C1x I2C interface
AudioHD link interface to baseboard for Codec
Digital I/O4 channels IN & 4 channels OUT (SDIO optional)
SMBusYes
TPMTPM 1.2
Hardware MonitoringYes
Storage
SATA3x SATA-600
Expansion
PCI Express6 lanes of PCI Express Gen 3.0
Power
Power InputATX +12V, +5V; SB AT +12V
Battery SupportYes
Physical
Form FactorCOM Express Type 6 Compact Module
Size95x95mm
Board Thickness2.0mm
Environmental
Operating Temperature-40°C to +85°C
Operating Humidity10% to 95% relative humidity, non-condensing
Vibration3.5 Grms
