CEM322
COM Express Type 6 Compact Module with Intel® Pentium®/Celeron® or Atom® x6000 Series Processors
Features
- Intel® Pentium®/Celeron® or Atom® x6000 series processors
- Dual-channel DDR4-3200 SO-DIMM, up to 32GB
- 2 SATA 3.0
- Up to 6 lanes of PCI Express
- 2 USB 3.2 Gen1 and 8 USB 2.0
- Supports up to 64GB eMMC 5.1 (by request)
- Supports TPM 2.0
- COM Express Type 6 Compact Module form factor
- Lithium battery support
- Hardware monitoring
- Wake-on-LAN and PXE Boot ROM support
- Intel® Gen 11 Graphics Engines (SoC integrated)
Computer
CPUIntel Atom® x6425RE/x6413E/x6414RE or Intel® Pentium® J6426
ChipsetSoC integrated
System Memory2 x dual-channel DDR4-3200 SO-DIMM slot, up to 32GB
BIOSAMI uEFI (Legacy free)
On-board StorageeMMC 5.1, up to 64GB
Watchdog Timer65536 levels, 0 to 65535 sec
Display
GraphicsIntel® Gen 11 Graphics Engines (SoC integrated)
Display Interface1x LVDS 18/24-bit single/dual-channel; optional eDP 1.4b HBR3 5120x3200@60Hz; 2x DDI
I/o interfaces
SATA2x SATA 3.0
Ethernet1x 10/100/1000/2500 Mbps Ethernet with Intel® I226, Wake-on-LAN and PXE Boot ROM support
USB2x USB 3.2 Gen1, 8x USB 2.0
Serial1x LPC, 1x SPI, 2x TX/RX
AudioHD link interface to baseboard for audio codec
TPMTPM 2.0
SMBusYes
I2C1x
GPIO4-CH in/4-CH out
Smart BatteryYes
Hardware MonitoringYes
Storage
On-board eMMC 5.1up to 64GB
Expansion
PCI Express5x PCIe x16, 1x PCIe x1 (optional, by removing 2.5GbE)
Power
Power InputATX +12V, +5V; SB AT +12V
BatteryLithium
Physical
Dimensions95 x 95 mm
Board Thickness2.0 mm
Form FactorCOM Express Type 6 Compact Module
Environmental
Operating Temperature (Industrial)-40°C to +85°C (-40°F to +185°F) with system thermal solution
Operating Temperature (Standard)0°C to +60°C (+32°F to +140°F)
Relative Humidity10% to 95%, non-condensing
Vibration Endurance3.5 Grms
Computer
CPUIntel Atom® x6425RE/x6413E/x6414RE or Intel® Pentium® J6426
ChipsetSoC integrated
System Memory2 x dual-channel DDR4-3200 SO-DIMM slot, up to 32GB
BIOSAMI uEFI (Legacy free)
On-board StorageeMMC 5.1, up to 64GB
Watchdog Timer65536 levels, 0 to 65535 sec
Display
GraphicsIntel® Gen 11 Graphics Engines (SoC integrated)
Display Interface1x LVDS 18/24-bit single/dual-channel; optional eDP 1.4b HBR3 5120x3200@60Hz; 2x DDI
I/o interfaces
SATA2x SATA 3.0
Ethernet1x 10/100/1000/2500 Mbps Ethernet with Intel® I226, Wake-on-LAN and PXE Boot ROM support
USB2x USB 3.2 Gen1, 8x USB 2.0
Serial1x LPC, 1x SPI, 2x TX/RX
AudioHD link interface to baseboard for audio codec
TPMTPM 2.0
SMBusYes
I2C1x
GPIO4-CH in/4-CH out
Smart BatteryYes
Hardware MonitoringYes
Storage
On-board eMMC 5.1up to 64GB
Expansion
PCI Express5x PCIe x16, 1x PCIe x1 (optional, by removing 2.5GbE)
Power
Power InputATX +12V, +5V; SB AT +12V
BatteryLithium
Physical
Dimensions95 x 95 mm
Board Thickness2.0 mm
Form FactorCOM Express Type 6 Compact Module
Environmental
Operating Temperature (Industrial)-40°C to +85°C (-40°F to +185°F) with system thermal solution
Operating Temperature (Standard)0°C to +60°C (+32°F to +140°F)
Relative Humidity10% to 95%, non-condensing
Vibration Endurance3.5 Grms
